Silver plating solution ∼2,1 g/l metal content, electroless
Dodavatel: Thermo Fisher Scientific
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Nebezpečí
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44068.AK
44068.K2
44068.AKEA
1320
CZK
44068.AK
44068.K2
Silver plating solution ∼2,1 g/l metal content, electroless
Silver plating solution
Physical Form: Liquid
Density: 1.04
Appearance: Colourless
Melting Point: -5°
Boiling Point: 103-105°
UN No.: UN3287
MDL No.: MFCD00003397
Applications: For plating on copper, brass or copper alloys
Bod varu:
103…105 °C Bod tání: –5 °C Hustota: 1,04 Storage Temperature: Ambient |
MDL Number:
MFCD00003397 UN: 3287 ADR: 6.1,II |
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